COMPANY "Radiotechcomplect" has
launched CONTRACT MANUFACTURING FACILITIES in Shenzhen (China) . Our services include manufacturing
of printed circuit boards, procurement of electronic components, assembly and
testing of finished products. We offer complete production cycle or partial
assembly of electronic modules.
OUR
CONTRACT MANUFACTURING site (PCBA) is equipped with state-of-the-art technology
that allows performing production tasks of any complexity.
Our manufacturing facilities use modern
high-tech equipment which allows up to 10 million soldering points per day. Our
equipment allows you to mount components of 0201 case size, including:
- high-speed assembly machines HAKKO,
ERSA, Fineplacer Core, linear conveyor reflow soldering oven with linear
conveyor for SMT mounting of 0201 case size components and IC using 0.3mm pitch,
and SMT mounting of 0402case size
components and IC using 0.4mm pitch;
- printed circuit boards cleaning
system (ultrasound, bubbling, washing in deionized water), automatic jet
washing boards;
- mounting PCB using lead-free
technology;
- X-ray control of each soldered
chip;
- printers for automatic paste application MRM 125,
ASKA-GP, DESEN 1008 - Paste can be applied to the surface up to 0.3 mm;
- mounting type through hole
components, BGA package (mBGA), technology COB (Chip-on-Board) with 0.3 mm
pitch.
Quality and Control
For electronic devices operating in extreme
conditions, at customer’s request we can perform tests for resistance to
climate and mechanical stress.
A scanner is configured for a visual inspection
of the quality and conformity of soldered components.
Final check
Our experts check and make sure of the proper
functioning of each module. They will identify potential failures. In order to
proceed with testing you should send us a circuit diagram and a step-by-step
instruction for required functional control, indicating the points of voltage supply
and the expected response of the module.